Epoxy Molding Compound for IC & Memory Package

Traditional Epoxy Molding Compound is dominated by the big Japanese corporations.

In the last decade, when Japan faces with economic slowdown in which its corporation scale down in R&D investment, 2 Korean corporations rise and grow rapidly to become formidable EMC makers with continuous technological development.

Our partner is one that will set the global standard that goes beyond the production in Korea.

The application of EMC is to provide protection the Chip from external Environment such as humidity, shock etc.  It composes of Epoxy Resin, Hardener, Filler (Silica)  and Additives.

Our EMC is applicable to both Transfer mold & Compression mold with excellent reliability performance.

Our EMC support the below ranged of packages:

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